Electronic device

ABSTRACT

An electronic device includes a display panel, a cushion member disposed below the display panel, an electronic module inserted into a hole defined by the display panel and the cushion member, and a light blocking pattern disposed on the electronic module with the display panel therebetween. The electronic module is spaced apart from a sidewall configured to define the hole in a first state in which the display panel and the cushion member are folded and a second state in which the display panel and the cushion member are unfolded.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from and the benefit of Korean PatentApplication Nos. 10-2020-0018620, filed on Feb. 14, 2020, and10-2020-0050006, filed on Apr. 24, 2020, which is hereby incorporated byreference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the invention relate generally to a foldableelectronic device.

Discussion of the Background

An electronic device typically includes an active area that is activatedaccording to an electrical signal. The electronic device detects aninput that is applied from the outside through the active area andsimultaneously displays various images to provide information to a user.In recent years, as electronic devices having various shapes have beendeveloped, active areas having various shapes have been used.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Devices constructed according to exemplary embodiments of the inventionare capable of providing an electronic device in which an active area isexpanded in area.

Devices constructed according to exemplary embodiments of the inventionare also capable of providing an electronic device having improvedproduct reliability.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

One or more exemplary embodiments of the inventive concepts provide anelectronic device including: a display panel; a cushion member disposedbelow the display panel; an electronic module inserted into a holedefined by the display panel and the cushion member; and a lightblocking pattern disposed on the electronic module with the displaypanel therebetween, wherein the electronic module is spaced apart from asidewall configured to define the hole in a first state in which thedisplay panel and the cushion member are folded and a second state inwhich the display panel and the cushion member are unfolded.

In an embodiment, the light blocking pattern may be spaced apart from aviewing angle area of the electronic module in the first state and thesecond state.

In an embodiment, the hole may include a first hole portion defined inthe display panel and a second hole portion defined in the cushionmember, and the second hole portion may have a width greater than thatof the first hole portion.

In an embodiment, when viewed on a plane, the light blocking pattern mayoverlap a sidewall of the display panel, which defines the first holeportion.

In an embodiment, when viewed on a plane, a sidewall of the cushionmember, which defines the second hole portion, may surround the lightblocking pattern.

In an embodiment, a sidewall of the cushion member, which defines thesecond hole portion, may not overlap the light blocking pattern.

In an embodiment, a plate may be disposed below the cushion member,wherein a third hole portion having a width greater than that of thefirst hole portion and less than that of the second hole portion may bedefined in the plate, and the first hole portion, the second holeportion, and the third hole portion may overlap each other to define thehole.

In an embodiment, the light blocking pattern may have a ring shape withan inner diameter and an outer diameter surrounding the inner diameter,and the inner diameter may be less than the first hole portion, and theouter diameter may be greater than the first hole portion.

In an embodiment, a first distance between the inner diameter and anedge of the display panel, which defines the first hole portion, may bedifferent from a second distance between the outer diameter and the edgeof the display panel, which defines the first hole portion.

In an embodiment, the first distance may be greater than the seconddistance.

In an embodiment, each of the first distance and the second distance maybe determined based on component tolerances, equipment tolerances, andfolding tolerances.

In an embodiment, the electronic device may include an impact absorbinglayer disposed on the display panel and a hard coating layer disposedbetween the impact absorbing layer and the display panel, wherein aportion of the hard coating layer may be exposed through the hole.

In an embodiment, the impact absorbing layer may include a stretchedfilm of which an optical axis is controlled.

In an embodiment, the electronic device may include a window disposed onthe light blocking pattern and a protective layer disposed on thewindow, wherein a sidewall of the protective layer may further protrudefrom a sidewall of the window.

In an embodiment, a distance between the window and the electronicmodule may be about 60% or more of total sum of thicknesses ofcomponents, each of which has a modulus equal to or less than areference modulus, among components in which the hole is defined.

In an embodiment, the reference modulus may be about 50 MPa or less.

One or more exemplary embodiments of the inventive concepts provides anelectronic device that includes: a display panel; an electronic moduledisposed to overlap a hole defined in the display panel; and a lightblocking pattern having a ring shape disposed on the electronic modulewith the display panel therebetween and having an inner diameter and anouter diameter surrounding the inner diameter, wherein a first distancebetween the inner diameter and an edge of the display panel, whichdefines the hole, is different from a second distance between the outerdiameter and the edge of the display panel, which defines the hole.

In an embodiment, the first distance may be greater than the seconddistance.

In an embodiment, each of the first distance and the second distance maybe determined based on component tolerances, equipment tolerances, andfolding tolerances.

In an embodiment, in a first state, in which the display panel isfolded, and a second state, in which the display panel is unfolded, theelectronic module may be spaced apart from the edge of the displaypanel.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification. The drawings illustrate exampleembodiments of the inventive concepts and, together with thedescription, serve to explain principles of the inventive concepts.

FIG. 1A is a perspective view of an electronic device according to anembodiment of the inventive concepts.

FIG. 1B is a perspective view of an electronic device according to anembodiment of the inventive concepts.

FIG. 2 is a cross-sectional view of the electronic device, taken alongline I-I′ of FIG. 1A, according to an embodiment of the inventiveconcepts.

FIG. 3A is a cross-sectional view of a display panel according to anembodiment of the inventive concepts.

FIG. 3B is a cross-sectional view of a display panel according to anembodiment of the inventive concepts.

FIG. 4 is an exploded perspective view illustrating a portion ofconstituents of the electronic device according to an embodiment of theinventive concepts.

FIG. 5 is a rear view illustrating a portion of constituents of anelectronic device according to an embodiment of the inventive concepts.

FIG. 6 is a cross-sectional view taken along line II-If of FIG. 1Aaccording to an embodiment of the inventive concepts.

FIG. 7 is a plan view of the electronic device according to anembodiment of the inventive concepts.

FIG. 8 is a cross-sectional view taken along line of FIG. 1A accordingto an embodiment of the inventive concepts.

FIG. 9A is a perspective view illustrating an operation of theelectronic device according to an embodiment of the inventive concepts.

FIG. 9B is a cross-sectional view taken along line IV-IV′ of FIG. 9A;

FIG. 10A is a perspective view illustrating an operation of theelectronic device according to an embodiment of the inventive concepts.

FIG. 10B is a cross-sectional view taken along line V-V′ of FIG. 10A.

FIG. 11 is a cross-sectional view for explaining design dimensions ofthe electronic device according to an embodiment of the inventiveconcepts.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the DR1-axis, theDR2-axis, and the DR3-axis are not limited to three axes of arectangular coordinate system, such as the x, y, and z-axes, and may beinterpreted in a broader sense. For example, the DR1-axis, the DR2-axis,and the DR3-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another. For thepurposes of this disclosure, “at least one of X, Y, and Z” and “at leastone selected from the group consisting of X, Y, and Z” may be construedas X only, Y only, Z only, or any combination of two or more of X, Y,and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, theterm “and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly. As used herein, “viewedon a plane” refers to a plan view from a direction normal to recitedlayers and/or substrates.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

As customary in the field, some exemplary embodiments are described andillustrated in the accompanying drawings in terms of functional blocks,units, and/or modules. Those skilled in the art will appreciate thatthese blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some exemplary embodiments may be physically separated intotwo or more interacting and discrete blocks, units, and/or moduleswithout departing from the scope of the inventive concepts. Further, theblocks, units, and/or modules of some exemplary embodiments may bephysically combined into more complex blocks, units, and/or moduleswithout departing from the scope of the inventive concepts.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Hereinafter, example (i.e., “exemplary”) embodiments of the inventiveconcepts will be described with reference to the accompanying drawings.

FIG. 1A is a perspective view of an electronic device according to anembodiment of the inventive concepts. FIG. 1B is a perspective view ofan electronic device according to an embodiment of the inventiveconcepts. FIG. 1A illustrates an unfolded state of an electronic device1000, and FIG. 1B illustrates a folded state of the electronic device1000.

Referring to FIGS. 1A and 1B, the electronic device 1000 may be a devicethat is activated according to an electrical signal. For example, theelectronic device 1000 may be a mobile phone, a tablet PC, a carnavigation system, a game console, or a wearable device, but is notlimited thereto. FIG. 1A illustrates an example in which the electronicdevice 1000 is in the form of a mobile phone.

The electronic device 1000 may display an image through an active area1000A. In a state in which the electronic device 1000 is unfolded, theactive area 1000A may include a plane defined by a first direction DR1and a second direction DR2. A thickness direction of the electronicdevice 1000 may be parallel to a third direction DR3 crossing the firstdirection DR1 and the second direction DR2. Thus, a front surface (ortop surface) and a rear surface (or bottom surface) of each of membersconstituting the electronic device 1000 may be defined based on thethird direction DR3.

The active area 1000A may include a first area 1000A1, a second area1000A2, and a third area 1000A3. The second area 1000A2 may be bent withrespect to a folding axis FX extending along the second direction DR2.Thus, the first area 1000A1 and the third area 1000A3 may be referred toas non-folding areas, and the second area 1000A2 may be referred to as afolding area.

When the electronic device 1000 is folded, the first area 1000A1 and thethird area 1000A3 may face each other. Thus, in the fully folded state,the active area 1000A may not be exposed to the outside, which may bereferred to as in-folding. However, this is merely an example, and anoperation of the electronic device 1000 is not limited thereto.

For example, in an embodiment of the inventive concepts, when theelectronic device 1000 is folded, the first area 1000A1 and the thirdarea 1000A3 may be opposite to each other. Thus, in the folded state,the active area 1000A may be exposed to the outside, which may bereferred to as out-folding.

The electronic device 1000 may perform only one operation of thein-folding and the out-folding. Alternatively, the electronic device1000 may perform all the operations of the in-folding and theout-folding. In this case, the same area of the electronic device 1000,for example, the second area 1000A2 may be in-folded and out-folded.Alternatively, one area of the electronic device 1000 may be in-folded,and the other area may be out-folded.

FIGS. 1A and 1B, one folding area and two non-folding areas areillustrated as an example, but the number of folding and non-foldingareas is not limited thereto. For example, the electronic device 1000may include more than two folding areas, i.e., a plurality ofnon-folding areas and a plurality of folding areas disposed between thenon-folding areas adjacent to each other.

FIGS. 1A and 1B illustrate that the folding axis FX is parallel to ashort axis of the electronic device 1000 in a second direction DR2, butembodiments of the inventive concepts are not limited thereto. Forexample, the folding axis FX may extend along a long axis of theelectronic device 1000, for example, in a direction parallel to thefirst direction DR1. In this case, the first area 1000A1, the secondarea 1000A2, and the third area 1000A3 may be sequentially arrangedalong the second direction DR2.

A plurality of sensing areas 100SA1, 100SA2, and 100SA3 may be definedon the electronic device 1000. In FIG. 1A, the three sensing areas100SA1, 100SA2, and 100SA3 are exemplarily illustrated, but the numberof plurality of sensing areas 100SA1, 100SA2, and 100SA3 is not limitedthereto.

The plurality of sensing areas 100SA1, 100SA2, and 100SA3 may include afirst sensing area 100SA1, a second sensing area 100SA2, and a thirdsensing area 100SA3. For example, the first sensing area 100SA1 mayoverlap a camera module, and the second sensing area 100SA2 and thethird sensing area 100SA3 may overlap a proximity illumination sensor,but is not limited thereto.

Each of a plurality of electronic modules 2000 (see FIG. 4) may receivean external input transmitted through the first sensing area 100SA1, thesecond sensing area 100SA2, or the third sensing area 100SA3 or mayprovide an output through the first sensing area 100SA1, the secondsensing area 100SA2, or the third sensing area 100SA3.

The first sensing area 100SA1 may be surrounded by the active area1000A, and the second sensing area 100SA2 and the third sensing area100SA3 may be included in the active area 1000A. That is, the secondsensing area 100SA2 and the third sensing area 100SA3 may display animage. Each of the first sensing area 100SA1, the second sensing area100SA2, and the third sensing area 100SA3 may have transmittance greaterthan that of the active area 1000A. Also, the first sensing area 100SA1may have transmittance greater than each of those of the second sensingarea 100SA2 and the third sensing area 100SA3.

According to an embodiment of the inventive concepts, a portion of theplurality of electronic modules 2000 (see FIG. 4) may overlap the activearea 1000A, and the other portion of the plurality of electronic modules2000 (see FIG. 4) may be surrounded by the active area 1000A. Thus, itis unnecessary to provide an area, on which the plurality of electronicmodules 2000 (see FIG. 4) are disposed, to a peripheral area 1000NAaround the active area 1000A. As a result, an area ratio of the activearea 1000A to the front surface of the electronic device 1000 mayincrease.

FIG. 2 is a cross-sectional view of the electronic device, taken alongline I-I′ of FIG. 1A, according to an embodiment of the inventiveconcepts. FIG. 3A is a cross-sectional view of a display panel accordingto an embodiment of the inventive concepts.

Referring to FIG. 2, the electronic device 1000 may include a displaypanel 100, upper functional layers, and lower functional layers.

Referring to FIG. 3A, the display panel 100 may be configured togenerate an image and sense an input applied from the outside. Forexample, the display panel 100 may include a display layer 110 and asensor layer 120. The display panel 100 may have a thickness of about 25micrometers to about 35 micrometers, for example, about 30 micrometers,and the thickness of the display panel 100 is not limited thereto.

The display layer 110 may be configured to substantially generate animage. The display layer 110 may be an emission-type display layer, forexample, the display layer 110 may be an organic light emitting displaylayer, a quantum dot display layer, or a micro LED display layer.

The display layer 110 may include a base layer 111, a circuit layer 112,a light emitting element layer 113, and an encapsulation layer 114.

The base layer 111 may include a synthetic resin film. The syntheticresin layer may include a thermosetting resin. The base layer 111 mayhave a multi-layered structure. For example, the base layer 111 may havea three-layered structure constituted by a synthetic resin layer, anadhesive layer, and a synthetic resin layer. Particularly, the syntheticresin layer may be a polyimide resin layer, and the material thereof isnot particularly limited. The synthetic resin layer may include at leastone of an acrylic-based resin, a methacrylic-based resin, apolyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyamide-based resin, or a perylene-based resin. In addition, the baselayer 111 may include a glass substrate or an organic/inorganiccomposite substrate.

The circuit layer 112 may be disposed on the base layer 111. The circuitlayer 112 may include an insulation layer, a semiconductor pattern, aconductive pattern, and a signal line. The insulating layer, thesemiconductor layer, and the conductive layer may be formed on the baselayer 111 in a manner such as coating or vapor deposition, and then, theinsulating layer, the semiconductor layer, and the conductive layer maybe selectively patterned through a plurality of photolithographyprocesses. Thereafter, the semiconductor pattern, the conductivepattern, and the signal line included in the circuit layer 112 may beformed.

The light emitting element layer 113 may be disposed on the circuitlayer 112. The light emitting element layer 113 may include a lightemitting element. For example, the light emitting element layer 113 mayinclude an organic light emitting material, quantum dots, quantum rods,or micro LEDs.

The encapsulation layer 114 may be disposed on the light emittingelement layer 113. The encapsulation layer 114 may include an inorganiclayer, an organic layer, and an inorganic layer, which are sequentiallylaminated, but layers constituting the encapsulation layer 114 are notlimited thereto.

The inorganic layers may protect the light emitting element layer 113against moisture and oxygen, and the organic layer may protect the lightemitting element layer 113 against foreign substances such as dustparticles. The inorganic layers may include a silicon nitride layer, asilicon oxy nitride layer, a silicon oxide layer, a titanium oxidelayer, or an aluminum oxide layer. The organic layer may include anacrylic-based organic layer, but embodiments of the inventive conceptsare not limited thereto.

The sensor layer 120 may be disposed on the display layer 110. Thesensor layer 120 may sense an external input applied from the outside.The external input may be a user's input. The user's input may includevarious types of external inputs such as a portion of user's body,light, heat, a pen, a pressure, or the like.

The sensor layer 120 may be disposed on the display layer 110 through acontinuous process. In this case, the sensor layer 120 may be expressedas being directly disposed on the display layer 110. The directdisposition may mean that a third component is not disposed between thesensor layer 120 and the display layer 110. That is, a separate adhesivemember may not be disposed between the sensor layer 120 and the displaylayer 110.

Alternatively, the sensor layer 120 may be bonded to the display layer110 through an adhesive member. The adhesive member may include a commonadhesive or an adhesive agent.

Referring again to FIG. 2, the upper functional layers may be disposedon the display panel 100. For example, the upper functional layers mayinclude an anti-reflection member 200 and an upper member 300.

The anti-reflection member 200 may be referred to as an anti-reflectionlayer. The anti-reflection member 200 may reduce reflectance of externallight incident from the outside. The anti-reflection member 200 mayinclude a stretched synthetic resin film. For example, theanti-reflection member 200 may be provided by dyeing an iodine compoundon a polyvinyl alcohol film (PVA film). However, this is merely anexample, and the material constituting the anti-reflection member 200 isnot limited thereto. The anti-reflection member 200 may have a thicknessof about 25 micrometers to about 35 micrometers, for example, about 31micrometers, and the thickness of the anti-reflection member 200 is notlimited thereto.

The anti-reflection member 200 may be bonded to the display panel 100through a first adhesive layer 1010. The first adhesive layer 1010 maybe a transparent adhesive layer such as a pressure sensitive adhesivefilm (PSA), an optically clear adhesive film (OCA), or an opticallyclear resin (OCR). Hereinafter, the adhesive member may include ageneral adhesive or adhesive agent. The first adhesive layer 1010 mayhave a thickness of about 20 micrometers to about 30 micrometers, forexample, about 25 micrometers, and the thickness of the first adhesivelayer 1010 is not limited thereto.

In an embodiment of the inventive concepts, the first adhesive layer1010 may be omitted. In this case, the anti-reflection member 200 may bedirectly disposed on the display panel 100. In the case, a separateadhesive layer may not be disposed between the anti-reflection member200 and the display panel 100.

The upper member 300 may be disposed on the anti-reflection member 200.The upper member 300 includes a first hard coating layer 310, aprotective layer 320, a first upper adhesive layer 330, a window 340, asecond upper adhesive layer 350, a light blocking layer 360, an impactabsorbing layer 370, and a second hard coating layer 380. The componentsincluded in the upper member 300 are not limited to the componentsdescribed above. At least a portion of the above-described componentsmay be omitted, and other components may be added.

The first hard coating layer 310 may be a layer disposed on theoutermost surface of the electronic device 1000. The first hard coatinglayer 310 may be a functional layer for improving use characteristics ofthe electronic device 1000 and may be applied on the protective layer320. For example, anti-fingerprint properties, anti-pollutionproperties, and anti-scratch properties may be improved by the firsthard coating layer 310.

The protective layer 320 may be disposed below the first hard coatinglayer 310. The protective layer 320 may protect constituents disposedbelow the protective layer 320. The first hard coating layer 310, theanti-fingerprint layer, and the like may be additionally provided on theprotective layer 320 to improve properties such as chemical resistanceand abrasion resistance. The protective layer 320 may include a filmhaving an elastic modulus of about 15 GPa or less at room temperature.The protective layer 320 may have a thickness of about 50 micrometers toabout 60 micrometers, for example, about 55 micrometers, but thethickness of the protective layer 320 is not limited thereto. In anembodiment, the protective layer 320 may be omitted.

The first upper adhesive layer 330 may be disposed below the protectivelayer 320. The protective layer 320 and the window 340 may be bonded toeach other by the first upper adhesive layer 330. The first upperadhesive layer 330 may have a thickness of about 20 micrometers to about30 micrometers, for example, about 25 micrometers, but the thickness ofthe first upper adhesive layer 330 is not limited thereto.

The window 340 may be disposed below the first upper adhesive layer 330.The window 340 may include an optically transparent insulation material.For example, the window 340 may include a glass substrate or a syntheticresin film. When the window 340 is the glass substrate, the window 340may have a thickness of about 80 micrometers or less and may have, forexample, a thickness of about 30 micrometers, but the thickness of thewindow 340 is not limited thereto.

When the window 340 is the synthetic resin film, the window 340 mayinclude a polyimide (Pl) film or a polyethylene terephthalate (PET)film.

The window 340 may has a single layered structure or a multilayeredstructure. For example, the window 340 may include a plurality ofplastic films bonded to each other by using an adhesive or include aglass substrate and a plastic film, which are bonded to each other byusing an adhesive.

The second upper adhesive layer 350 may be disposed below the window340. The window 340 and the impact absorbing layer 370 may be bonded toeach other by the second upper adhesive layer 350. The second upperadhesive layer 350 may have a thickness of about 30 micrometers to about40 micrometers, for example, about 35 micrometers, but the thickness ofthe second upper adhesive layer 350 is not limited thereto.

In an embodiment of the inventive concepts, a sidewall 340S of thewindow 340 and a sidewall 350S of the second upper adhesive layer 350may be disposed inside sidewalls of other layers, for example, asidewall 100S of the display panel 100 and a sidewall 320S of theprotective layer 320. The inside disposition may mean that the activearea 1000A is closer to other comparison objects.

A positional relationship between the layers may be changed by thefolding operation of the electronic device 1000. According to anembodiment of the inventive concepts, since the sidewall 340S of thewindow 340 is disposed inside the sidewall 100S of the display panel 100and the sidewall 320S of the protective layer 320, even though thepositional relationship between the layers is changed, possibility thatthe sidewall 340S of the window 340 protrudes from the sidewall 320S ofthe protective layer 320 may be reduced. Thus, possibility that anexternal impact is transmitted through the sidewall 340S of the window340 may be reduced. As a result, probability that cracks occurs in thewindow 340 may be reduced.

A first distance 340W between the sidewall 340S of the window 340 andthe sidewall 320S of the protective layer 320 may be equal to or greaterthan a predetermined distance. Here, the first distance 340W may mean adistance in a direction parallel to the first direction DR1. Also, thefirst distance 340W may correspond to a distance between the sidewall340S and the sidewall 320S when viewed on a plane.

The first distance 340W may be about 180 micrometers to about 205micrometers, for example, about 196 micrometers, but is not limitedthereto. For example, the first distance 340W may be about 50micrometers or more and may be about 300 micrometers. As the firstdistance 340W increases, the protective layer 320 may further protrudesfrom the window 340, and a portion of the protective layer 320 may bebent and attached to other components, for example, a case. Also, as theprotective layer 320 increase in area, probability that foreignsubstances introduced from an upper side of the protective layer 320 areintroduced to a lower side of the protective layer 320 may be reduced.

Also, the window 340 and the second upper adhesive layer 350 may bebonded to the impact absorbing layer 370 through a lamination process.In consideration of a lamination process tolerance, each of the window340 and the second upper adhesive layer 350 may have an area less thanthat of the impact absorbing layer 370. In addition, the second upperadhesive layer 350 may have an area less than that of the window 340.For example, a pressure may be applied to the second upper adhesivelayer 350 in the process of attaching the window 340. The second upperadhesive layer 350 may receive a pressure and then be stretched in adirection parallel to the first direction DR1 and the second directionDR2. Here, the second upper adhesive layer 350 may have an area lessthan that of the window 340 so that the second upper adhesive layer 350does not protrude from the window 340.

When the first upper adhesive layer 330 and the second upper adhesivelayer 350 are attached to each other, the window 340 may not slip toprevent a buckling phenomenon from occurring when the electronic device1000 is folded. However, according to an embodiment of the inventiveconcepts, the second upper adhesive layer 350 may have an area less thanthat of the window 340. Thus, the first upper adhesive layer 330 may notbe attached to the second upper adhesive layer 350, and probability thatforeign substances adhere to the second upper adhesive layer 350 may bereduced.

A second distance 350W between the sidewall 350S of the second upperadhesive layer 350 and the sidewall 320S of the protective layer 320 maybe equal to or greater than a predetermined distance. Here, the seconddistance 350W may mean a distance in a direction parallel to the firstdirection DR1. Also, the second distance 350W may correspond to adistance between the sidewall 350S and the sidewall 320S when viewed onthe plane.

The second distance 350W may be about 392 micrometers, but is notlimited thereto. For example, the second distance 350W may be selectedfrom a range between about 292 micrometers and about 492 micrometers,but is not limited to this range. The light blocking layer 360 may bedisposed between the impact absorbing layer 370 and the second upperadhesive layer 350. The light blocking layer 360 may be provided bybeing printed on a top surface of the impact absorbing layer 370. Thelight blocking layer 360 may overlap the peripheral area 1000NA. Thelight blocking layer 360 may be a colored layer and may be formed in acoating manner. The light blocking layer 360 may include a coloredorganic material or an opaque metal, and the materials constituting thelight blocking layer 360 are not limited thereto.

In FIG. 2, the light blocking layer 360 is exemplarily illustrated asbeing disposed on the top surface of the impact absorbing layer 370, butthe position of the light blocking layer 360 is not limited thereto. Forexample, the light blocking layer 360 may be provided on a top surfaceof the protective layer 320, a bottom surface of the protective layer320, a top surface of the window 340, or a bottom surface of the window340. Also, the light blocking layer 360 may be provided as a pluralityof layers. In this case, a portion of the light blocking layer 360 maybe disposed on the top surface of the impact absorbing layer 370, theother portion may be disposed on the top surface of the protective layer320, the bottom surface of the protective layer 320, the top surface ofthe window 340, or the bottom surface of the window 340.

The impact absorbing layer 370 may be a functional layer for protectingthe display panel 100 from an external impact. The impact absorbinglayer 370 may be selected from films having an elastic modulus of about1 GPa or more at room temperature. The impact absorbing layer 370 may bea stretched film including an optical function. For example, the impactabsorbing layer 370 may be an optical axis control film. The impactabsorbing layer 370 may have a thickness of about 35 micrometers toabout 45 micrometers, for example, about 41 micrometers, but thethickness of the impact absorbing layer 370 is not limited thereto. Inan embodiment of the inventive concepts, the impact absorbing layer 370may be omitted.

The second hard coating layer 380 may be provided on a surface of theimpact absorbing layer 370. The impact absorbing layer 370 may include acurved surface. The top surface of the impact absorbing layer 370 maycontact the second upper adhesive layer 350. Thus, the curved portion ofthe top surface of the impact absorbing layer 370 may be filled by thesecond upper adhesive layer 350. Thus, an optical issue may not occur onthe top surface of the impact absorbing layer 370. The bottom surface ofthe impact absorbing layer 370 may be planarized by the second hardcoating layer 380. That is, when a first hole 101H (see FIG. 4) isprovided up to the second adhesive layer 1020 by cutting, a surfaceexposed by the first hole 101H (see FIG. 4) may be smooth. Thus, as thesecond hard coating layer 380 covers an uneven surface of the impactabsorbing layer 370, haze that may occur on the uneven surface of theimpact absorbing layer 370 may be prevented from occurring.

The upper member 300 may be bonded to the anti-reflection member 200through the second adhesive layer 1020. The second adhesive layer 1020may include a common adhesive or a sticking agent. The second adhesivelayer 1020 may have a thickness of about 20 micrometers to about 30micrometers, for example, about 25 micrometers, and the thickness of thesecond adhesive layer 1020 is not limited thereto.

The lower functional layers may be disposed below the display panel 100.For example, the lower functional layers may include a lower protectivefilm 400, a cushion member 500, a first lower member 600, a second lowermember 700, and a step compensation member 800. The components includedin the lower functional layers are not limited to the componentsdescribed above. At least a portion of the above-described componentsmay be omitted, and other components may be added.

The lower protective film 400 may be bonded to a rear surface of thedisplay panel 100 through the third adhesive layer 1030. The lowerprotective film 400 may prevent scratches from being generated in therear surface of the display panel 100 during the process ofmanufacturing the display panel 100. The lower protective film 400 maybe a colored polyimide film. For example, the lower protective film 400may be an opaque yellow film, but is not limited thereto.

The lower protective film 400 may have a thickness of about 30micrometers to about 50 micrometers, for example, about 40 micrometers.The third adhesive layer 1030 may have a thickness of about 13micrometers to about 25 micrometers, for example, about 18 micrometers.However, the thickness of the lower protective film 400 and thethickness of the third adhesive layer 1030 are not limited thereto.

The cushion member 500 may be disposed below the lower protective film400. The cushion member 500 may protect the display panel 100 from animpact transmitted from the lower portion. The impact resistancecharacteristics of the electronic device 1000 may be improved by thecushion member 500.

The cushion member 500 may include a first cushion adhesive layer 510, abarrier film 520, a cushion layer 530, and a second cushion adhesivelayer 540. The components included in the cushion member 500 are notlimited to the components described above. At least a portion of theabove-described components may be omitted, and other components may beadded.

The first cushion adhesive layer 510 and the second cushion adhesivelayer 540 may include a common adhesive or an adhesive agent. The firstcushion adhesive layer 510 may be attached to the lower protective film400, and the second cushion adhesive layer 540 may be attached to thefirst lower member 600. The first cushion adhesive layer 510 may have athickness of about 20 micrometers to about 30 micrometers, for example,about 25 micrometers. The second cushion adhesive layer 540 may have athickness of about 4 micrometers to about 15 micrometers, for example,about 8 micrometers. However, the thickness of each of the first cushionadhesive layer 510 and the second cushion adhesive layer 540 is notlimited thereto.

The barrier film 520 may be provided to improve impact resistanceperformance. The barrier film 520 may serve to prevent the display panel100 from being deformed. The barrier film 520 may be a synthetic resinfilm, for example, a polyimide film, but is not limited thereto. Thebarrier film 520 may have a thickness of about 30 micrometers to about40 micrometers, for example, about 35 micrometers, but the thickness ofthe barrier film 520 is not limited thereto.

The cushion layer 530 may include, for example, foamed foam or sponge.The foamed foam may include polyurethane foam or thermoplasticpolyurethane foam. When the cushion layer 530 includes the foamed foam,the cushion layer 530 may be formed by using the barrier film 520 as abase layer. For example, a foaming agent may be foamed on the barrierfilm 520 to form the cushion layer 530.

The cushion layer 530 may have a thickness of about 80 micrometers toabout 120 micrometers, for example, about 100 micrometers, but thethickness of the cushion layer 530 is not limited thereto.

At least one of the barrier film 520 or the cushion layer 530 may have acolor that absorbs light. For example, at least one of the barrier film520 or the cushion layer 530 may have a black color. In this case, thecomponents disposed below the cushion member 500 may be prevented frombeing visible from the outside.

The first lower member 600 may be disposed below the cushion member 500.The first lower member 600 may include a plate 610, a lower adhesivelayer 620, and a cover layer 630. The components included in the firstlower member 600 are not limited to the components described above. Atleast a portion of the above-described components may be omitted, andother components may be added.

The plate 610 may include a material having an elastic modulus of about60 GPa or more at room temperature. For example, the plate 610 may beSUS304, but is not limited thereto. The plate 610 may support componentsdisposed at an upper side. Also, heat dissipation performance of theelectronic device 1000 may be improved by the plate 610.

An opening 611 may be defined in a portion of the plate 610. The opening611 may be defined in an area overlapping the second area 1000A2. Theopening 611 may overlap the second area 1000A2 on the plane, forexample, when viewed in the third direction DR3. A portion of the plate610 may be more easily deformed by the opening 611.

The cover layer 630 may be attached to the plate 610 by the loweradhesive layer 620. The lower adhesive layer 620 may include a commonadhesive or an adhesive agent. The cover layer 630 may cover the opening611 of the plate 610. Thus, foreign substances may be additionallyprevented from being into the opening 611.

The cover layer 630 may include a material having an elastic modulusless than that of the plate 610. For example, the cover layer 630 mayinclude thermoplastic polyurethane, but is not limited thereto.

The plate 610 may have a thickness of about 120 micrometers to about 180micrometers, for example, about 150 micrometers. The lower adhesivelayer 620 may have a thickness of about 4 micrometers to about 15micrometers, for example, about 8 micrometers. The cover layer 630 mayhave a thickness of about 4 micrometers to about 15 micrometers, forexample, about 8 micrometers. However, the thickness of the plate 610,the thickness of the lower adhesive layer 620, and the thickness of thecover layer 630 are not limited to the above-described values.

The second lower member 700 may be disposed below the first lower member600. The second lower members 700 may be spaced apart from each other.For example, one second lower member 700 may be disposed on the firstarea 1000A1 and the other second lower member 700 may be disposed on thethird area 1000A3.

Each of the second lower members 700 may be attached to the first lowermember 600 by the fourth adhesive layers 1040. For example, one fourthadhesive layer 1040 may be attached to a bottom surface of the firstlower member 600 overlapping the first area 1000A1, and the other fourthadhesive layer 1040 may be attached to the bottom surface of the firstlower member 600 overlapping the third area 1000A3. That is, the fourthadhesive layers 1040 may not overlap the second area 1000A2. Each of thefourth adhesive layers 1040 may have a thickness of about 8 micrometersto about 15 micrometers, for example, about 8 micrometers, but thethickness of each of the fourth adhesive layers 1040 is not limitedthereto.

Although not shown, a step compensation film may be further disposedbetween each of the second lower members 700 and the first lower member600. For example, the step compensation film may be provided on an areaoverlapping the second area 1000A2. One surface of the step compensationfilm may have adhesive force less than that of the other surface. Forexample, the one surface may not have adhesive force. The one surfacemay be a surface facing the first lower member 600.

Each of the second lower members 700 may include a lower plate 710, aheat dissipation sheet 720, and an insulating film 730. The componentsincluded in the second lower members 700 are not limited to thecomponents described above. At least a portion of the above-describedcomponents may be omitted, and other components may be added.

The lower plate 710 is provided in plurality. One of the lower plates710 may be disposed to overlap the first area 1000A1 and a portion ofthe second area 1000A2, and the other portion of the lower plates 710may be disposed to overlap the other portion of the second area 1000A2and the third area 1000A3.

The lower plates 710 may be disposed to be spaced apart from each otheron the second area 1000A2. However, the lower plates 710 may be disposedas close as possible to support the area in which the opening 611 of theplate 610 is defined. For example, the lower plates 710 may prevent ashape of the area, in which the opening 611 of the plate 610 is defined,from being deformed by a pressure applied from the upper portion.

Also, the lower plates 710 may serve to prevent the components disposedabove the second lower member 700 from being deformed by the componentsdisposed below the second lower member 700.

Each of the lower plates 710 may include a metal alloy. For example,each of the lower plates 710 may include a copper alloy. However, thematerial forming the lower plate 710 is not limited thereto. Each of thelower plates 710 may have a thickness of about 60 micrometers to about100 micrometers, for example, about 80 micrometers, and the thickness ofthe lower plates 710 is not limited thereto.

The heat dissipation sheet 720 may be attached below the lower plate710. The heat dissipation sheet may be a thermal conductive sheet havinghigh thermal conductivity. For example, the heat dissipation sheet 720may include a heat dissipation layer 721, a first heat dissipationadhesive layer 722, a second heat dissipation adhesive layer 723, and agap tape 724.

The gap tape 724 may be attached to the first heat dissipation adhesivelayer 722 and the second heat dissipation adhesive layer 723, which arespaced apart from each other, with the heat dissipation layer 721therebetween. The gap tape 724 may be provided as a plurality of layers.For example, the gap tape 724 may include a base layer, an upperadhesive layer disposed on a top surface of the base layer, and a loweradhesive layer disposed on a bottom surface of the base layer.

The heat dissipation layer 721 may be attached to the lower plate 710 bythe first heat dissipation adhesive layer 722. The heat dissipationlayer 721 may be sealed by the first heat dissipation adhesive layer722, the second heat dissipation adhesive layer 723, and the gap tape724. The heat dissipation layer 721 may be a graphitized polymer film.The polymer film may be, for example, a polyimide film. Each of thefirst heat dissipation adhesive layer 722 and the second heatdissipation adhesive layer 723 may have a thickness of about 3micrometers to about 8 micrometers, for example, about 5 micrometers,and each of the heat dissipation layer 721 and the gap tape 724 may havea thickness of about 10 micrometers to about 25 micrometers, forexample, about 17 micrometers. However, the thickness of each of thefirst heat dissipation adhesive layer 722, the second heat dissipationadhesive layer 723, the heat dissipation layer 721, and the gap tape 724is not limited to the above-described numerical value.

The insulating film 730 may be attached below the heat dissipation sheet720. For example, the insulating film 730 may be attached to the secondheat dissipation adhesive layer 723. An occurrence of rattling of theelectronic device 1000 may be prevented by the insulating film 730. Theinsulating film 730 may have a thickness of about 15 micrometers, but isnot limited thereto.

The step compensation member 800 may be attached below the plate 610.For example, the lower adhesive layer 620 may be attached below oneportion of the plate 610, and the step compensation member 800 may beattached below the other portion of the plate 610.

The step compensation member 800 may include a first compensationadhesive layer 810, a step compensation film 820, and a secondcompensation adhesive layer 830. The first compensation adhesive layer810 may be attached to the bottom surface of the plate 610. The stepcompensation film 820 may be a synthetic resin film. The secondcompensation adhesive layer 830 may be attached to a bottom surface anda set (not shown) of the step compensation film 820.

FIG. 3B is a cross-sectional view of a display panel according to anembodiment of the inventive concepts.

Referring to FIG. 3B, a display panel 100 aa may further include ananti-reflection layer 130 when compared with the display panel 100described in FIG. 3A. In this case, the anti-reflection member 200 (seeFIG. 2) and the first adhesive layer 1010 (see FIG. 2) may be removedfrom the electronic device 1000 (see FIG. 2) including the display panel100 aa.

The display panel 100 aa may include a display layer 110, a sensor layer120, and an anti-reflection layer 130.

The anti-reflection layer 130 according to an embodiment of theinventive concepts may include color filters. The color filters may havea predetermined arrangement. The arrangement of the color filters may bedetermined in consideration of emission colors of pixels included in thedisplay layer 110. Also, the anti-reflection layer 130 may furtherinclude a black matrix adjacent to the color filters.

The anti-reflection layer 130 according to an embodiment of theinventive concepts may include a destructive interference structure. Forexample, the destructive interference structure include first reflectionlayer and a second reflection layer, which are disposed on layersdifferent from each other. First reflected light and second reflectedlight, which are respectively reflected from the first reflection layerand the second reflection layer, may destructively interfere, and thus,the external light may be reduced in reflectance.

FIG. 4 is an exploded perspective view illustrating a portion ofconstituents of the electronic device according to an embodiment of theinventive concepts.

Referring to FIG. 4, a light blocking layer 360, a display panel 100,and a plurality of electronic modules 2000 among the components of theelectronic device 1000 (see FIG. 2) are exemplarily illustrated. Theplurality of electronic modules 2000 may include a camera module 2100and a proximity illumination sensor 2200.

The proximity illumination sensor 2200 may include a light emittingmodule 2210 and a light receiving module 2220. The light emitting module2210 and the light receiving module 2220 may be mounted on onesubstrate. The light emitting module 2210 may generate and output light.For example, the light emitting module 2210 may output infrared rays.Also, the light emitting module 2210 may include a light emitting diode.The light receiving module 2220 may sense the infrared rays. The lightreceiving module 2220 may be activated when infrared rays having apredetermined level or more is sensed. The light receiving module 2220may include a CMOS sensor. The infrared rays generated in the lightemitting module 2210 may be outputted and then be reflected by anexternal subject (for example, a user's finger or face), and thereflected infrared rays may be incident into the light receiving module2220.

An active area 100A and a peripheral area 100NA may be defined on thedisplay panel 100. The active area 100A may correspond to the activearea 1000A illustrated in FIG. 1A, and the peripheral area 100NA maycorrespond to the peripheral area 1000NA illustrated in FIG. 1A.

A first sensing area 100SA1 overlapping the camera module 2100 may besurrounded by the active area 100A, and a second sensing area 100SA2overlapping the light emitting module 2210 and a third sensing area100SA3 overlapping the light receiving module 2220 may be portions ofthe active area 100A.

A first hole 101H may be defined in a portion of the display panel 100.The first hole 101H may be provided to correspond to the first sensingarea 100SA1. Thus, the camera module 2100 may receive an external inputtransmitted through the first hole 101H.

The light blocking layer 360 may include a first light blocking pattern361 and a second light blocking pattern 362. The first light blockingpattern 361 may be a pattern covering the peripheral area 100NA. Whenviewed on the plane, the second light blocking pattern 362 may surroundthe camera module 2100.

FIG. 5 is a rear view illustrating a portion of constituents of anelectronic device according to an embodiment of the inventive concepts.

Referring to FIGS. 4 and 5, the display panel 100, the step compensationmember 800, the heat dissipation layer 721, and the gap tape 724 areexemplarily illustrated.

A first hole 101H, a second hole 102H, and a third hole 103H may beprovided to correspond to the first sensing area 100SA1, the secondsensing area 100SA2, and the third sensing area 100SA3, respectively.

The first hole 101H, the second hole 102H, and the third hole 103H maybe provided by removing some constituents of the electronic device 1000(see FIG. 1A), and thus, a detailed description thereof will bedescribed later.

The first hole 101H may be provided to overlap the step compensationmember 800, and each of the second hole 102H and the third hole 103H maybe provided to overlap the gap tape 724. Thus, when viewed on the plane,the first hole 101H may be surrounded by the step compensation member800, and each of the second hole 102H and the third hole 103H may besurrounded by the gap tape 724.

FIG. 6 is a cross-sectional view taken along line II-IF of FIG. 1Aaccording to an embodiment of the inventive concepts.

Referring to FIG. 6, the first hole 101H in which the camera module 2100is inserted is illustrated. The first hole 101H may include a first holeportion 101H1, a second hole portion 101H2, and a third hole portion101H3.

The first hole portion 101H1 may be defined by a first sidewall SW1, thesecond hole portion 101H2 may be defined by a second sidewall SW2, andthe third hole portion 101H3 may be defined by the third sidewall SW3.

The first hole portion 101H1, the second hole portion 101H2, and thethird hole portion 101H3 may have sizes different from each other. Forexample, the first hole portion 101H1 may have the smallest size, thesecond hole portion 101H2 may have the largest size, and the third holeportion 101H3 may have a size corresponding between the size of thefirst hole portion 101H1 and the size of the second hole portion 101H2.

The first hole portion 101H1 may be formed through a laser cuttingprocess. For example, the first hole portion 101H1 may be formed bycutting a portion from the lower protective film 400 to the secondadhesive layer 1020 using a laser. The second hole portion 101H2 may bea portion provided in the cushion member 500, and the cushion member 500may be punched to define the second hole portion 101H2. The cushionmember 500 in which the second hole portion 101H2 is defined may beattached to the lower protective film 400. The plate 610 and the stepcompensation member 800 may be punched to define the third hole portion101H3. The third hole portion 101H3 may be formed by a shearing processon the plate 610 and the step compensation member 800.

According to an embodiment of the present disclosure, the cushion member500 in which the second hole portion 101H2 is defined may be attached tothe plate 610 in which the third hole portion 101H3 is defined.Thereafter, the cushion member 500 may be attached to the lowerprotective film 400. Thus, the sizes of the first hole portion 101H1,the second hole portion 101H2, and the third hole portion 101H3 may bedifferent from each other in consideration of component tolerances,equipment tolerances, and folding tolerances.

The folding tolerances may be tolerances generated by the foldingoperation of the electronic device 1000. For example, the foldingtolerances may be tolerances in consideration of a moving amount (orslip) of each of the components when the electronic device 1000 is fullyfolded or tolerances in consideration of an unrestored moving amount ofeach of the component when the electronic device 1000 is unfolded afterbeing folded.

According to an embodiment of the inventive concepts, since the sizes ofthe first hole portion 101H1, the second hole portion 101H2, and thethird hole portion 101H3 are determined in consideration of the foldingtolerances, an interference between the inner sidewall of the first hole101H and the electronic module inserted into the first hole 101H, forexample, the camera module 2100, may not occur. Also, a second lightblocking pattern 362 disposed corresponding to the position of the firsthole 101H may also be disposed in consideration of the foldingtolerances. Thus, even when the electronic device 1000 is folded andunfolded, the second light blocking pattern 362 may cover the activearea 100A (see FIG. 4) of the display panel 100, or possibility that thesecond light blocking pattern 362 covers a viewing angle area 2100AV ofthe camera module 2100 may be reduced.

The camera module 2100 may be inserted and disposed within the firsthole 101H. The second upper adhesive layer 350, the light blocking layer360, the impact absorbing layer 370, and the second hard coating layer380 may be disposed between the camera module 2100 and the window 340.Thus, since at least one or more layers are disposed between the cameramodule 2100 and the window 340, possibility that the window 340 isdamaged by the camera module 2100 may be reduced. Therefore, productreliability may be improved.

A top surface 2100U of the camera module 2100 may be disposed within thesecond hole portion 101H2 provided in the cushion member 500. The secondhole portion 101H2 may be a hole portion having the largest diameteramong the first to third hole portions 101H1, 101H2, and 101H3.Therefore, even if the electronic device 1000 is folded, and thus, thepositional relationship between the layers is deformed, probability ofcollision with the second sidewall SW2 of the camera module 2100 may bereduced. Therefore, product reliability may be improved.

The position of the top surface 2100U of the camera module 2100 is notlimited to the example illustrated in FIG. 6. For example, the topsurface 2100U of the camera module 2100 may be disposed within the firsthole portion 101H1. In this case, a width 362W of the area surrounded bythe second light blocking pattern 362 may be designed to be less thanthat when the top surface 2100U of the camera module 2100 is disposed inthe second hole portion 101H2.

For example, the second light blocking pattern 362 may be designed so asnot to overlap the viewing angle area 2100AV of the camera module 2100.When viewed on the plane, the second light blocking pattern 362 may bedisposed to be spaced a predetermined distance from the viewing anglearea 2100AV of the camera module 2100 in consideration of processerrors. Since the camera module 2100 is closer to the second lightblocking pattern 362, even if the width 362W of the area surrounded bythe second light blocking pattern 362 is reduced, the second lightblocking pattern 362 may not cover the viewing angle area 2100V of thecamera module 2100.

According to an embodiment of the inventive concepts, a distance DTbetween the camera module 2100 and the window 340 may be secured over apredetermined distance. When the distance DT between the camera module2100 and the window 340 is secured over the predetermined distance,probability that the window 340 is damaged by the camera module 2100 maybe reduced. Therefore, the product reliability may be improved. Thedamage may be cracks when the window 340 is provided as the glasssubstrate or may be step when the window 340 is provided as thesynthetic resin film.

For example, the distance DT may range of about 60% to about 200% of thetotal sum of the thicknesses of the components in which a modulus of thefirst hole 101H is less than or equal to the reference modulus. Thecomponents in which the first hole 101H is defined in FIG. 3 maycorrespond to components disposed below the second hard coating layer380. The reference modulus may be about 100 MPa or less, for example,about 50 MPa or less and 0 MPa or more.

The components that are provided with the first hole 101H definedtherethrough and have the modulus equal to or smaller than the referencemodulus may include the first adhesive layer 1010, the second adhesivelayer 1020, the third adhesive layer 1030, the first cushion adhesivelayer 510, the cushion layer 530, the second cushion adhesive layer 540,the first compensation adhesive layer 810, and the second compensationadhesive layer 830.

The first adhesive layer 1010 may have a thickness of about 25micrometers, the second adhesive layer 1020 may have a thickness ofabout 25 micrometers, the third adhesive layer 1030 may have a thicknessof about 18 micrometers, the first cushion adhesive layer 510 may have athickness of about 25 micrometers, the cushion layer 530 may have athickness of about 100 micrometer, the second cushion adhesive layer 540may have a thickness of about 8 micrometer, the first compensationadhesive layer 810 may have a thickness of about 17 micrometer, and thesecond compensation adhesive layer 830 may have a thickness of about 17micrometers. Each of the thicknesses may have a process error. Thus, thesum of the thicknesses may be about 183 micrometers to about 300micrometers, for example, about 235 micrometers. However, the sum of thethicknesses is not limited thereto.

The distance DT between the camera module 2100 and the window 340 may bedetermined in consideration of a maximum compression ratio of thelayers, each of which has a modulus equal to or less than the referencemodulus. For example, the distance DT may be equal to or greater thanthe sum of the thicknesses multiplied by the maximum compression ratio.The distance DT may be may be about 110 micrometers or more, forexample, about 141 micrometers or more.

According to an embodiment of the inventive concepts, even though thecomponents are maximally compressed by the pressure generated while theelectronic device 1000 is used, the window 340 and the camera module2100 may be spaced a predetermined distance from each other. Thus, theprobability that the window 340 is damaged by the camera module 2100 maybe greatly reduced. Therefore, the product reliability may be improved.

FIG. 7 is a plan view of the electronic device according to anembodiment of the inventive concepts.

In FIG. 7, the second light blocking pattern 362, the first sidewallSW1, the second sidewall SW2, and the third sidewall SW3 are exemplarilyillustrated.

When viewed on the plane, the first sidewall SW1 may overlap the secondlight blocking pattern 362, and the second sidewall SW2 and the thirdsidewall SW3 may not overlap the second light blocking pattern 362. Whenviewed on the plane, the third sidewall SW3 may surround the secondlight blocking pattern 362, and the second sidewall SW2 may surround thethird sidewall SW3.

Referring to FIGS. 6 and 7, a first width WT1 of the first hole portion101H1, a second width WT2 of the second hole portion 101H2, and a thirdwith WT3 of the third hole portion 101H3 may be different from eachother. For example, the second width WT2 may be greater than each of thefirst width WT1 and the third width WT3, and the third width WT3 may begreater than the first width WT1.

FIG. 8 is a cross-sectional view taken along line of FIG. 1A accordingto an embodiment of the inventive concepts.

Referring to FIG. 8, the third hole 103H in which the light receivingmodule 2220 is inserted is illustrated. Since the second hole 102H (seeFIG. 5) into which the light emitting module 2210 (see FIG. 4) isinserted may have substantially the same cross-sectional structure asthe third hole 103H, contents with respect to the second hole 102H (seeFIG. 5) may be understood through the following description.

The third hole 103H may include a first hole portion 103H1 and a secondhole portion 103H2. The first hole portion 103H1 may be defined by thefirst sidewall SW13, and the second hole portion 103H2 may be defined bythe second sidewall SW23.

The first hole portion 103H1 and the second hole portion 103H2 may havesizes different from each other. For example, the size of the first holeportion 103H1 may be larger than that of the second hole portion 103H2.

The first hole portion 103H1 may be a portion provided in the cushionmember 500, and the cushion member 500 may be punched to define thefirst hole portion 103H1. The first lower member 600 and the secondlower member 700 may be punched to define a second hole portion 103H2.

The third hole 103H may not be provided in the display panel 100. Forexample, the third hole 103H may be provided in only at least a portionof the components disposed below the display panel 100. Thus, a portionof the display panel 100 overlapping the third hole 103H may display animage and sense an input applied from the outside.

The first hole 101H (see FIG. 6) may pass through the display panel 100,but the third hole 103H may not pass through the display panel 100. Thatis, a depth DT1 (see FIG. 6) of the first hole 101H (see FIG. 6) may begreater than that DT2 of the third hole 103H.

FIG. 9A is a perspective view illustrating an operation of theelectronic device according to an embodiment of the inventive concepts.FIG. 9B is a cross-sectional view taken along line IV-IV′ of FIG. 9A.FIG. 10A is a perspective view illustrating an operation of theelectronic device according to an embodiment of the inventive concepts.FIG. 10B is a cross-sectional view taken along line V-V′ of FIG. 10A.

FIG. 9A illustrates a state in which the electronic device 1000 is fullyfolded. This may be referred to as a first state. FIG. 9B illustrates across-sectional view illustrating a state in which the first sensingarea 100SA1 of the electronic device 1000 that is folded in the state ofFIG. 9A is cut. FIG. 10A illustrates a state in which the electronicdevice 1000 is folded and then unfolded again. This may be referred toas a second state. FIG. 9B illustrates a cross-sectional viewillustrating a state in which the first sensing area 100SA1 of theelectronic device 1000 that is unfolded in the state of FIG. 10A is cut.

FIGS. 9A, 9B, 10A, and 10B illustrate views of the electronic device1000 disposed in a chamber so as to measure a positional moving amountand an unrestored moving amount of each of the components due to thefolding and the unfolding.

In FIGS. 9A and 10A, the electronic device 1000 is tested as an example,but is not limited thereto. For example, the test may be performed onlywith some components of the electronic device 1000, or the test may beperformed with a product designed similarly to the electronic device1000.

Since the adhesive layers and the tapes have a lot of slip due to shearunder high-temperature environments, the test may be performed in astate in which the adhesive layers and the tapes are disposed in thechamber having a high temperature so as to measure the positional movingamount and the unrestored moving amount of each of the components due tothe folding and the unfolding. The high temperature may be, for example,about 60 degrees Celsius, but is not limited thereto.

Referring to FIGS. 9A and 9B, when the electronic device 1000 is folded,the shapes of components, each of which has a relatively low modulus,may be deformed. For example, the shapes of the second adhesive layer1020, the first adhesive layer 1010, the third adhesive layer 1030, thefirst cushion adhesive layer 510, and the second cushion adhesive layer540 may be deformed. For example, side surfaces of the second adhesivelayer 1020, the first adhesive layer 1010, the third adhesive layer1030, the first cushion adhesive layer 510, and the second cushionadhesive layer 540, which are deformed, may be inclined in thirddirection DR3.

In FIG. 9B, the positions of the components before being folded areshown by dotted lines, and the positions of the components in the fullyfolded state are shown by solid lines. The positions of the componentsdisposed on the plate 610 with respect to the plate 610 may be changed.The plate 610 may be SUS304 or a rigid material. Therefore, thepositions of the components disposed on the plate 610 with respect tothe plate 610 may be deformed in a direction crossing the folding axisFX (see FIG. 1A), for example, the second direction DR2.

According to an embodiment of the inventive concepts, in the state inwhich the electronic device 1000 is fully folded, the positions of thefirst hole 101H and the second light blocking pattern 362 may bedesigned so that the camera module 2100 does not collide with thesidewalls constituting the first hole 101H, and the second lightblocking pattern 362 does not cover the viewing angle area 2100AV of thecamera module 2100. A detailed description related to this configurationwill be described later.

Referring to FIGS. 10A and 10B, even when the electronic device 1000 isunfolded again, the shapes of the components may not be partiallyrestored. In FIG. 10B, the positions of the components before beingfolded are shown by dotted lines, and the positions of the componentswhen being unfolded again after being fully folded are shown by solidlines.

According to an embodiment of the inventive concepts, when theelectronic device 1000 is unfolded again, the positions of the firsthole 101H and the second light blocking pattern 362 may be designed inconsideration of the positions of the components that are not restored.A detailed description related to this configuration will be describedlater.

FIG. 11 is a cross-sectional view for explaining design dimensions ofthe electronic device according to an embodiment of the inventiveconcepts.

Referring to FIGS. 9A, 9B, 10A, 10B, and 11, a first design object FD1,a second design object FD2, a third design object FD3, a fourth designobject FD4, a fifth design object FDS, a sixth design object FD6, aseventh design object FD7, and an eighth design object FD8 areillustrated as an example.

The second light blocking pattern 362 may have a ring shape having aninner diameter 3621 and an outer diameter 3620 surrounding the innerdiameter 3621. The first design target FD1 is a distance between an edge100E of the display panel 100 and the inner diameter 3621 of the secondlight blocking pattern 362. The second design target FD2 is a distancebetween the edge 100E of the display panel 100 and the outer diameter3620 of the second light blocking pattern 362.

The third design target FD3 is a distance between the outer diameter3620 of the second light blocking pattern 362 and the active area 100Aof the display panel 100. The fourth design target FD4 is a distancebetween the inner diameter 3621 of the second light blocking pattern 362and the viewing angle area 2100AV. The fifth design target FD5 is adistance between the edge 100E of the display panel 100 and the cameramodule 2100. The sixth design object FD6 is a distance between the edge100E of the display panel 100 and the cushion member 500. The seventhdesign object FD7 is a distance between the edge 100E of the displaypanel 100 and the plate 610. The eighth design object FD8 is a distancebetween the plate 610 and the step compensation member 800.

All the above-described distances may be distances in a directionparallel to the first direction DR1. Also, the above-described distancesmay correspond to a distance between the two components when theelectronic device 1000 is viewed on the plane.

A numerical value of each of the first design object FD1, the seconddesign object FD2, the third design object FD3, the fourth design objectFD4, the fifth design object FD5, the sixth design object FD6, theseventh design object FD7, and the eighth design object FD8 may bedesigned in consideration of the component tolerances, the equipmenttolerances, the characteristic tolerances, and the folding tolerances.

For example, the component tolerances may include a tolerance generatedin the process of printing the second light blocking pattern 362, atolerance with respect to the size of the second light blocking pattern362, a tolerance with respect to the position of the second lightblocking pattern 362, a tolerance with respect to a position of analignment mark of the panel 100, a tolerance with respect to an outerperiphery of the cushion member 500, a tolerance with respect to thesize of the second hole portion 101H2 of the cushion member 500, atolerance with respect to the position of the second hole portion 101H2of the cushion member 500, a tolerance with respect to an outerperiphery of the plate 610, a tolerance with respect to the size of thethird hole portion 101H3 of the plate 610, and a tolerance with respectto the position of the third hole portion 101H3 of the plate 610.

For example, the equipment tolerances may include a tolerance generatedin the process of cutting the first hole portion 101H1 by using thelaser, a tolerance generated in the process of laminating the uppermember 300 to the configuration including the display panel 100, atolerance generated in the process of laminating the cushion member 500to the configuration including the display panel 100, and a tolerancegenerated in the process of laminating the cushion member 500 to theplate 610. The configuration including the display panel 100 may referto the components from the second adhesive layer 1020 to the lowerprotective film 400.

For example, the characteristic tolerances may be tolerances due tohigh-temperature shrinkage of the anti-reflection member 200 and thesecond adhesive layer 1020.

For example, the folding tolerances may be tolerances generated due tothe folding operation of the electronic device 1000 and may include amoving amount DS1 of the display panel 100, which is measured withrespect to the plate 610 in the folded state, an unrestored movingamount DS2 of the second light blocking pattern 362, an unrestoredmoving amount DS3 between the anti-reflection member 200 and the layerincluding the second light blocking pattern 362, and an unrestoredmoving amount DS4 between the display panel 100 and the layer includingthe second light blocking pattern 362.

In Table 1 below, component tolerance data and equipment tolerance datafor determining the dimensions of each of the first design object FD1,the second design object FD2, the fourth design object FD4, and thefifth design object FD5 were shown.

TABLE 1 Tolerance Tolerance type (mm) Tolerances generated in process ofprinting second light 0.05 blocking pattern 362 Tolerance with respectto size of second light blocking 0.04 pattern 362 Tolerance with respectto position of second light 0.1 blocking pattern 362 Tolerance withrespect to position of alignment mark of 0.01 display panel 100Tolerance generated in process of cutting first hole 0.09 portion 101H1by using laser Tolerances generated in process of laminating upper 0.125member 300 to configuration including display panel 100 First RSS(Component tolerance + Equipment tolerance) 0.195

The first RSS (Root Sum of Squares) value may be calculated by Equation1 below.

$\begin{matrix}{3*\sqrt{\begin{matrix}{( {0.05/3} )^{2} + ( {0.04/3} )^{2} + ( {0.1/3} )^{2} + ( {0.01/3} )^{2} + ( {0.09/3} )^{2} +} \\( {0.125/3} )^{2}\end{matrix}}} & {{Equation}\mspace{14mu} 1}\end{matrix}$

The dimension of the first design object FD1 may be determined based onthe sum of the first RSS values and the first other tolerances. Thefirst other tolerances may include a tolerance generated by the residualadhesive of the second adhesive layer 1020 and a tolerance generatedwhen the components of the electronic device 1000 are not restored.Specifically, the tolerance generated due to the unrestoration may be anunrestored moving amount DS4 (see FIG. 10B) between the display panel100 and the layer including the second light blocking pattern 362. Forexample, the tolerance generated due to the unrestoration may be anunrestored movement amount DS4 (see FIG. 10B) between the display panel100 and the upper member 300. The tolerance due to the residual adhesiveof the adhesive layer may be about 0.05 mm, and the unrestored movingamount DS4 (see FIG. 10B) may be about 0.094 mm.

When the first other tolerances are added to the first RSS value, thetolerance may be about 0.339 mm. Since the viewing angle area 2100AV andthe second light blocking pattern 362 should not overlap each other, asmaller design dimension of the first design target FD1 than thecalculated value may be advantageous. Therefore, the first design objectFD1 may be designed with a numerical value less than the calculatedvalue. For example, the first design object FD1 may be designed with atolerance of about 0.287 mm.

The dimension of the second design object FD2 may be determined based onthe sum of the first RSS value and the second other tolerances. Thesecond other tolerances may include a tolerance due to high-temperatureshrinkage of the anti-reflection member 200 and the second adhesivelayer 1020 and a tolerance generated when the components of theelectronic device 1000 are not restored. Specifically, the second othertolerances may include an unrestored moving amount between theanti-reflection member 200 and the layer including the second lightblocking pattern 362 DS3 (see FIG. 10B). For example, the second othertolerances may include an unrestored moving amount DS3 between theanti-reflection member 200 and the upper member 300. The tolerance dueto the high-temperature shrinkage of the adhesive layer may be about0.03 mm, and the unrestored moving amount DS3 (see FIG. 10B) may beabout 0.014 mm.

If the second other tolerances are added to the first RSS value, thetolerance may be about 0.241 mm. The second design object FD2 may bedesigned with calculated value. Therefore, the second design object FD2may be designed with a tolerance of about 0.241 mm.

The second light blocking pattern 362 may be provided to prevent lightblurring from occurring in the camera module 2100. Therefore, thedimension of the first design object FD1 may be designed to be greaterthan that of the second design object FD2.

The dimension of the fourth design object FD4 may be designed based onthe sum of the first RSS value and the fourth other tolerance. Thefourth other tolerance may be the unrestored moving amount DS2 (see FIG.10B) of the second light blocking pattern 362. The unrestored movingamount DS2 (see FIG. 10B) may be about 0.051 mm.

When the fourth other tolerance is added to the first RSS value, thetolerance may be about 0.246 mm. The fourth design object FD4 may beselected within a predetermined range based on the calculated value. Forexample, the fourth design object FD4 may be designed with a toleranceof about 0.0245 mm.

The dimension of the fifth design object FD5 may be designed based onthe sum of the first RSS value and the fifth other tolerance. The fifthother tolerance may be a moving amount DS1 of the display panel 100,which is measured with respect to the plate 610. For example, a movingamount DS1 of the display panel 100 may be measured by a distance DS1 abetween the plate 610 before being folded and the edge 100E of thedisplay panel 100 and a distance DS1 b between the plate 610 in thefully folded state and the edge 100E of the display panel 100.

When the fifth other tolerance is added to the first RSS value, thetolerance may be about 0.320 mm. The fifth design object FD5 may bedesigned based on the calculated value. In consideration of the case inwhich the top surface 2100U of the camera module 2100 is disposed up tothe first hole portion 101H1, the fifth design object FD5 may bedesigned more sufficiently than the calculated value so that the displaypanel 100 and the camera module 2100 do not collide with each other. Forexample, the fifth design object FD5 may be designed with a tolerance ofabout 0.483 mm.

Table 2 below shows component tolerance data and equipment tolerancedata for determining the dimensions of the third design object FD3.

TABLE 2 Tolerance Tolerance type (mm) Tolerances generated in process ofprinting second light 0.05 blocking pattern 362 Tolerance with respectto size of second light blocking 0.04 pattern 362 Tolerance with respectto position of second light 0.1 blocking pattern 362 Tolerance withrespect to position of alignment mark of 0.01 display panel 100Tolerances generated in process of laminating upper 0.125 member 300 tothe configuration including display panel 100 Second RSS (Componenttolerance + Equipment tolerance) 0.173

The second RSS value may be calculated by Equation 2 below.

$\begin{matrix}{3*\sqrt{( {0.05/3} )^{2} + ( {0.04/3} )^{2} + ( {0.1/3} )^{2} + ( {0.01/3} )^{2} + ( {0.125/3} )^{2}}} & {{Equation}\mspace{14mu} 2}\end{matrix}$

The dimension of the third design object FD3 may be determined based onthe sum of the second RSS value and the third other tolerance. The thirdother tolerance may be an unrestored moving amount DS4 (see FIG. 10B)between the display panel 100 and the layer including the second lightblocking pattern 362. For example, the tolerance generated due to theunrestoration may be an unrestored movement amount DS4 (see FIG. 10B)between the display panel 100 and the upper member 300. The unrestoredmoving amount DS4 (see FIG. 10B) may be about 0.094 mm.

When the third other tolerance is added to the second RSS value, thetolerance may be about 0.267 mm. As the design value of the third designobject FD3 decreases, the area other than the active area 100A maydecrease. Thus, the design dimension of the third design object FD3 maybe designed with a value less than the calculated value. For example,the third design object FD3 may be designed with a tolerance of about0.230 mm.

Table 3 below shows component tolerance data and equipment tolerancedata for determining the dimensions of the sixth design object FD6.

TABLE 3 Tolerance Tolerance type (mm) Tolerance with respect to outerperiphery of cushion 0.075 member 500 Tolerance with respect to size ofsecond hole portion 0.05 101H2 of cushion member 500 Tolerance withrespect to position of second hole 0.15 portion 101H2 of cushion member500 Tolerance with respect to position of alignment mark 0.01 of displaypanel 100 Tolerance with respect to outer periphery of plate 610 0.06Tolerance generated in process of cutting first hole 0.09 portion 101H1by using laser Tolerances generated in process of laminating cushion0.125 member 500 to configuration including display panel 100 Tolerancegenerated in process of laminating cushion 0.150 member 500 to plate 610Third RSS (Component tolerance + Equipment tolerance) 0.284

The third RSS value may be calculated by Equation 3 below.

$\begin{matrix}{3*\sqrt{\begin{matrix}{( {0.075/3} )^{2} + ( {0.05/3} )^{2} + ( {0.15/3} )^{2} + ( {0.01/3} )^{2} +} \\{( {0.006/3} )^{2} + ( {0.09/3} )^{2} + ( {0.125/3} )^{2} + ( {0.15/3} )^{2}}\end{matrix}}} & {{Equation}\mspace{14mu} 3}\end{matrix}$

The dimension of the sixth design object FD6 may be designed based onthe third RSS value. For example, the sixth design object FD6 may bedesigned with a tolerance of about 0.3 mm.

Table 4 below shows component tolerance data and equipment tolerancedata for determining the dimensions of the seventh design object FD7.

TABLE 4 Tolerance Tolerance type (mm) Tolerance with respect to outerperiphery of plate 610 0.06 Tolerance with respect to size of third holeportion 0.05 101H3 of plate 610 Tolerance with respect to position ofthird hole portion 0.1 101H3 of plate 610 Tolerance with respect toposition of alignment mark of 0.01 display panel 100 Tolerance generatedin process of cutting first hole 0.09 portion 101H1 by using laserTolerance generated in process of laminating cushion 0.150 member 500 toplate 610 Fourth RSS (Component tolerance + Equipment tolerance) 0.216

The fourth RSS value may be calculated by Equation 4 below.

$\begin{matrix}{3*\sqrt{\begin{matrix}{( {0.006/3} )^{2} + ( {0.05/3} )^{2} + ( {0.1/3} )^{2} + ( {0.01/3} )^{2} +} \\{( {0.09/3} )^{2} + ( {0.15/3} )^{2}}\end{matrix}}} & {{Equation}\mspace{14mu} 4}\end{matrix}$

The dimension of the seventh design object FD7 may be designed based onthe fourth RSS value. For example, the seventh design object FD7 may bedesigned with a tolerance of about 0.22 mm. The eighth design object FD8may be designed with a tolerance of about 0.5 mm.

Referring to FIGS. 6, 7, and 11, a first width WT1 of the first holeportion 101H1, a second width WT2 of the second hole portion 101H2, anda third with WT3 of the third hole portion 101H3 may be different fromeach other. For example, the second width WT2 may be greater than thefirst width WT1. For example, the second width WT2 may correspond to avalue obtained by adding the dimension of the sixth design object FD6twice to the first width WT1. Thus, the difference between the firstwidth WT1 and the second width WT2 may be about 0.6 mm. The differencebetween the second width WT2 and the third width WT3 may correspond to avalue obtained by adding the dimension of the seventh design object FD7twice. Thus, the difference between the second width WT2 and the thirdwidth WT3 may be about 0.44 mm.

The positional relationship between the second light blocking pattern362 and the first sidewall SW1 may be determined in consideration of thedimension of the first design object FD1 and the dimension of the seconddesign object FD2. For example, the second light blocking pattern 362may have a width of about 0.214 mm in a direction toward the active area100A with respect to the first sidewall SW1, and the second lightblocking pattern 362 may have a width of about 0.287 mm in a directiontoward the viewing angle area 2100AV with respect to the first sidewallSW1.

According to the inventive concepts, the first hole 101H defined in theelectronic device 1000 may include at least two or more hole portions101H1, 101H2, and 101H3. The hole portions 101H1, 101H2, and 101H3 mayhave sizes different from each other in consideration of the componenttolerances, the equipment tolerances, and the folding tolerances.Accordingly, even if the first hole 101H is provided in the foldableelectronic device 1000, the interference between the inner sidewall ofthe first hole 101H and the camera module 2100 may not occur. Also, thesecond light blocking pattern 362 disposed corresponding to the positionof the first hole 101H may also be disposed in consideration of thefolding tolerances. Accordingly, the second light blocking pattern 362may cover the active area 100A of the display panel 100, or thepossibility that the second light blocking pattern 362 covers a viewingangle area 2100AV of the camera module 2100 may be reduced.

According to the inventive concepts, a portion of the plurality ofelectronic modules may overlap the active area of the electronic device,and the other portion of the plurality of electronic modules may besurrounded by the active area. Therefore, it is unnecessary toseparately provide the area, on which the plurality of electronicmodules are arranged, to the peripheral area. As a result, the arearatio of the active area to the front surface of the electronic devicemay increase.

According to the inventive concepts, the hole defined in the electronicdevice may include at least two or more hole portions. The sizes of thehole portions may be different from each other in consideration of thecomponent tolerance, the equipment tolerance, and the folding tolerance.Therefore, even if the hole is provided in the foldable electronicdevice, the interference between the sidewall within the hole and theelectronic module inserted into the hole may not occur. In addition, thelight blocking pattern disposed to correspond to the position of thehole may also be designed in consideration of the folding tolerance.Therefore, the possibility that the light blocking pattern covers theactive area of the display panel or covers the viewing angle area of theelectronic module may be reduced.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. An electronic device comprising: a display panel;a cushion member disposed below the display panel; an electronic moduleinserted into a hole defined by the display panel and the cushionmember; and a light blocking pattern disposed to surround the electronicmodule with the display panel disposed between the light blockingpattern and the electronic module, wherein the electronic module isspaced apart from a sidewall configured to define the hole in a firststate in which the display panel and the cushion member are folded andin a second state in which the display panel and the cushion member areunfolded.
 2. The electronic device of claim 1, wherein the lightblocking pattern is spaced apart from a viewing angle area of theelectronic module in the first state and the second state.
 3. Theelectronic device of claim 1, wherein the hole comprises a first holeportion defined in the display panel and a second hole portion definedin the cushion member, and the second hole portion has a width greaterthan that of the first hole portion.
 4. The electronic device of claim3, wherein, when viewed on a plane, the light blocking pattern overlapsa sidewall of the display panel defining the first hole portion.
 5. Theelectronic device of claim 3, wherein, when viewed on a plane, asidewall of the cushion member defining the second hole portion isdisposed to surround the light blocking pattern.
 6. The electronicdevice of claim 3, wherein a sidewall of the cushion member defining thesecond hole portion does not overlap the light blocking pattern.
 7. Theelectronic device of claim 3, further comprising a plate disposed belowthe cushion member, wherein a third hole portion having a width greaterthan that of the first hole portion and less than that of the secondhole portion is defined in the plate, and the first hole portion, thesecond hole portion, and the third hole portion overlap each other todefine the hole.
 8. The electronic device of claim 3, wherein the lightblocking pattern has a ring shape having an inner diameter and an outerdiameter surrounding the inner diameter, and the inner diameter is lessthan a diameter of the first hole portion, and the outer diameter isgreater than the diameter of the first hole portion.
 9. The electronicdevice of claim 8, wherein a first distance between the inner diameterand an edge of the display panel defining the first hole portion isdifferent from a second distance between the outer diameter and the edgeof the display panel defining the first hole portion.
 10. The electronicdevice of claim 9, wherein the first distance is greater than the seconddistance.
 11. The electronic device of claim 9, wherein each of thefirst distance and the second distance is determined based on componenttolerances, equipment tolerances, and folding tolerances.
 12. Theelectronic device of claim 1, further comprising: an impact absorbinglayer disposed on the display panel; and a hard coating layer disposedbetween the impact absorbing layer and the display panel, wherein aportion of the hard coating layer is exposed through the hole.
 13. Theelectronic device of claim 12, wherein the impact absorbing layercomprises a stretched film of which an optical axis is controlled. 14.The electronic device of claim 1, further comprising: a window disposedon the light blocking pattern; and a protective layer disposed on thewindow, wherein a sidewall of the protective layer further protrudesfrom a sidewall of the window.
 15. The electronic device of claim 14,wherein a distance between the window and the electronic module is about60% or more of total sum of thicknesses of components, each of which hasa modulus equal to or less than a reference modulus, among components inwhich the hole is defined.
 16. The electronic device of claim 15,wherein the reference modulus is about 50 MPa or less.
 17. An electronicdevice comprising: a display panel; an electronic module disposed tooverlap a hole defined in the display panel; and a light blockingpattern having a ring shape disposed on the electronic module with thedisplay panel therebetween and having an inner diameter and an outerdiameter surrounding the inner diameter, wherein a first distancebetween the inner diameter and an edge of the display panel defining thehole is different from a second distance between the outer diameter andthe edge of the display panel defining the hole.
 18. The electronicdevice of claim 17, wherein the first distance is greater than thesecond distance.
 19. The electronic device of claim 17, wherein each ofthe first distance and the second distance is determined based oncomponent tolerances, equipment tolerances, and folding tolerances. 20.The electronic device of claim 17, wherein, in a first state, in whichthe display panel is folded, and a second state, in which the displaypanel is unfolded, the electronic module is spaced apart from the edgeof the display panel defining the hole.